Kevin Brosius on 27 Jun 2004 13:25:04 -0000 |
> > > You can take this for whatever it's worth, but with CPUs, less paste > > is better than more. You want only enough paste to fill in any > > crevices on the CPU and fitted heatsink. Thermal paste last time I > > checked was more efficient at heat dissipation than air, but less > > efficient than a direct metal to CPU assuming the CPU and heatsink are > > smooth, thus the least amount of paste to assure heat transfer is the > > wisest course. > > > What about those soft heat transfer patches that are like thick, > double-sided tape? That's what retail boxed AMD CPUs usually come with, > don't they? Yes, they aren't bad. Really depends on what you are doing. The overclockers need maximum heat transfer, and they say that the pads are thicker and lower transfer ratio than a thin layer of good quality paste applied to really flat surfaces. They also comment that pads are one time use, so you need to clean them off the heatsink/cpu and replace them if you take the cpu off at any point. You can read a bunch of cooling articles on the web. I'd start at http://hardocp.com/ and http://2cpu.com/, followed by a google search. The really intense guys actually polish the heatsink and cpu surfaces first, followed by a careful application of a thin layer of paste and assembly. Most people won't need to do that, if they aren't overclocking or running in especially hot environments. -- Kevin ___________________________________________________________________________ Philadelphia Linux Users Group -- http://www.phillylinux.org Announcements - http://lists.phillylinux.org/mailman/listinfo/plug-announce General Discussion -- http://lists.phillylinux.org/mailman/listinfo/plug
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